Thermal Paste Liquid Metal Based (100 g 2.5 W/mK)

Name : Thermal Paste Liquid Metal Based (100 g 2.5 W/mK)

Net Quantity (N) : 1

Top Quality thermal paste to provide thermal conductivity between heat source and heat sink and dissipate heat your computer laptops motherboard or other electronic components. Acts as a heat sink compound for transferring heat from Ics to heat Sinks.

Type

Liquid Metal Based

Quantity

100 g

Viscosity

1100 Pa-s

Thermal Conductivity

2.5 W/mK

Composition

sillicone compound 30%, carbon compound 30%, metal oxide 60%

Specific Gravity

2.55

Thermal Resistance

0.5 Km2/W

Suitable For

computer motherboard, laptop motherboard, graphics cards. Ics

Minimum Temperature Limit

-40

Maximum Temperature Limit

250 degree C

Paste Color

Grey

Country of Origin : India