AMAOE MQ3 Universal BGA Reballing Stencil for Mobile Motherboard Repair | High-Precision IC Reballing Tool for Chip-Level Work

Name : AMAOE MQ3 Universal BGA Reballing Stencil for Mobile Motherboard Repair | High-Precision IC Reballing Tool for Chip-Level Work

Net Quantity (N) : 1

The AMAOE MQ3 Universal BGA Reballing Stencil is a premium tool designed for professional chip-level repair and BGA IC reballing on various mobile logic boards. Crafted with advanced laser-cutting technology, this AMAOE MQ3 stencil ensures perfect hole alignment, enabling clean, accurate solder ball placement during the reballing process.

Made from ultra-durable stainless steel, the stencil withstands high soldering temperatures without bending or warping, making it ideal for repeated use in mobile motherboard repair. The AMAOE MQ3 stencil supports a wide range of BGA chip sizes and patterns, making it one of the most versatile and essential reballing tools for any mobile repair lab.

Its anti-slip surface, precise mesh design, and easy-to-clean finish make it a go-to choice for technicians who demand accuracy, speed, and stability during delicate SMD soldering and chip repair tasks.

This universal BGA reballing stencil is compatible with multiple CPU, EMMC, and IC chip layouts, providing a single solution for multiple motherboard repair jobs. Whether for replacing damaged ICs or restoring BGA connections, the AMAOE MQ3 BGA stencil offers professional-grade results with minimal effort.

Country of Origin : India